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Because of our early and pro-active response to lead-free process, our
roadmap schedule will most likely make our products lead-free before the
2006 compliance deadline.
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2004 Q4:
Evaluate new lead-free components and the compatibility with lead-free
solders/PCBs.
2005 Q1:
Qualification of lead-free components and updating the product portfolio
with lead-free solutions
that meet industrial standards.
2005 Q3:
Complete the preparation of manufacturing and assembly
process that can be used to manufacture RoHS-compliant
products.
2005 Q4: Start lead-free pilot run production.
2006 Q1: Start to to supply RoHS compliant products.
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